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1.2 mm FR4 DIP Multi Layer PCB Assembly HASL and Gold Finger with Green Solder Mask

1.2 mm FR4 DIP Multi Layer PCB Assembly HASL and Gold Finger with Green Solder Mask

1.2 mm FR4 DIP Multi Layer PCB Assembly HASL and Gold Finger with Green Solder Mask

Product Details:

Place of Origin: China
Brand Name: ZYX
Certification: UL, CE, RoHs, REACH, SGS
Model Number: ZYX

Payment & Shipping Terms:

Minimum Order Quantity: 10 PCS
Price: Negotiate
Packaging Details: Plastic bag + bubble packaging
Delivery Time: 5-7 DAYS
Payment Terms: L/C,T/T, Paypal, West Union
Supply Ability: 2 Million PCS Per Month
Detailed Product Description

Detailed Product Description
 

1.2 mm FR4 DIP Multi Layer PCB Assembly HASL and Gold Finger with Green Solder Mask

 

Quick Details:

1. Professional PCB manufacturer.

2. PCBA,OEM,ODM service are provided.

3. Gerber file needed.

4. Products are 100% E-tested.

5. Quality guarantee and professional after-sale service.

 

 PRODUCT’S DETAILS

 Raw Material

 FR-4 (Tg 180 available)

 Layer Count

 4-Layer

 Board Thickness

 1.2mm

 Copper Thickness

 1.0oz

 Surface Finish

 HASL/Gold Finger

 Solder Mask

 Green

 Silkscreen

 White

 Min. Trace Width/Spacing

 0.075/0.075mm

 Min. Hole Size

 0.25mm

 Hole Wall Copper Thickness

 ≥20μm 

 Measurement

 300×400mm

 Packaging

 Inner: Vacuum-packed in soft plastic bales 
 Outer: Cardboard Cartons with double straps

 Application

 Communication,automobile,cell,computer,medical 

 Advantage

 Competitive Price,Fast Delivery,OEM&ODM,Free Samples,

 Special Requirements

 Buried And Blind Via, Impedance Control, Via Plug, 
 BGA Soldering And Gold Finger Are Acceptable

 Certification

 UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

 
 

 PRODUCTION CAPABILITY OF PCB

 Process Engineering

 Items

 Manufacturing Capability

 Laminate

 Thickness

 0.2~3.2mm

 Production Type

 Layer Count

 2L-16L

 Cut Lamination

 Max. Working Panel size

 1000×1200mm

 Inner Layer

 Internal Core Thickness

 0.1~2.0mm

 Internal width/spacing

 Min: 4/4mil

 Internal Copper Thickness

 1.0~3.0oz

 Dimension

 Board Thickness Tolerance

 ±10%

 Interlayer Alignment

 ±3mil

 Drilling

 Manufacture Panel Size

 Max: 650×560mm

 Drilling Diameter

 ≧0.25mm

 Hole Diameter Tolerance

 ±0.05mm

 Hole Position Tolerance

 ±0.076mm

 Min.Annular Ring 

 0.05mm

 PTH+Panel Plating

 Hole Wall copper Thickness

 ≧20um

 Uniformity

 ≧90%

 Outer Layer

 Track Width

 Min: 0.08mm

 Track Spacing

 Min: 0.08mm

 Pattern Plating

 Finished Copper Thickness

 1oz~3oz

 EING/Flash Gold

 Nickel Thickness

 2.5um~5.0um

 Gold Thickness

 0.03~0.05um

 Solder Mask

 Thickness

 15~35um

 Solder Mask Bridge

 3mil

 Legend

 Line width/Line spacing

 6/6mil

 Gold Finger

 Nickel Thickness

 ≧120u〞

 Gold Thickness

 1~50u〞

 Hot Air Level

 Tin Thickness

 100~300u〞

 Routing

 Tolerance of Dimension

 ±0.1mm

 Slot Size

 Min:0.4mm

 Cutter Diameter

 0.8~2.4mm

 Punching

 Outline Tolerance

 ±0.1mm

 Slot Size

 Min:0.5mm

 V-CUT

 V-CUT Dimension

 Min:60mm

 Angle

 15°30°45°

 Remain Thickness Tolerance

 ±0.1mm

 Beveling

 Beveling Dimension

 30~300mm

 Test

 Testing Voltage

 250V

 Max.Dimension

 540×400mm

 Impedance Control

 Tolerance

 ±10%

 Aspect Ration

 12:1

 Laser Drilling Size

 4mil(0.1mm)

 

Contact Details
Shenzhen Zhong Yi Xin Circuit Co,. ltd.

Contact Person: Mr. Bryant

Tel: 86-0755-23599617-8:00

Fax: 86-0755-23599617

Send your inquiry directly to us (0 / 3000)