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High Tg FR4 PCB Board Layout Multi Layer PCB Finished with HASL or ENIG

High Tg FR4 PCB Board Layout Multi Layer PCB Finished with HASL or ENIG

    • High Tg FR4 PCB Board Layout Multi Layer PCB Finished with HASL or ENIG
    • High Tg FR4 PCB Board Layout Multi Layer PCB Finished with HASL or ENIG
  • High Tg FR4 PCB Board Layout Multi Layer PCB Finished with HASL or ENIG

    Product Details:

    Place of Origin: China
    Brand Name: ZYX
    Certification: UL, CE, RoHs, REACH, SGS
    Model Number: ZYX

    Payment & Shipping Terms:

    Minimum Order Quantity: 10 PCS
    Price: Negotiate
    Packaging Details: Plastic bag + bubble packaging
    Delivery Time: 5-7 DAYS
    Payment Terms: L/C,T/T, Paypal, West Union
    Supply Ability: 1 Million PCS Per Month
    Contact Now
    Detailed Product Description

    High Tg FR4 PCB Board Layout Multi Layer PCB Finished with HASL or ENIG

     

    Description:

    1. Best service with quick response is always provided for our customers.
    2. Certifications of ISO9001:2008,UL,CE,ROHS,REACH,HALOGEN-FREE is meet.
    3. Advanced  production equipment imported from Japan and Germany,such as                                          PCB Lamination Machine, CNC drilling machine,Auto-PTH line,                                   AOI(Automatic Optic Inspection),Probe Flying Machine and so on.
    4. Quality guarantee and professional after-sale service.
    5. All kinds of surface finish is accepted,such as ENIG,OSP.Immersion Silver,Immersion Tin,               Immersion Gold, Lead-free HASL,HAL.
    6. BGA,Blind&Buried Vias and Impedence Control is accepted.
    7. Gerber file needed.

     PRODUCT’S DETAILS

     Raw Material

     FR-4 (Tg 180 available)

     Layer Count

     2-Layer

     Board Thickness

     1.2mm

     Copper Thickness

     1.0oz

     Surface Finish

     HASL/ENIG

     Solder Mask

     GREEN/RED

     Silkscreen

     White

     Min. Trace Width/Spacing

     0.075/0.075mm

     Min. Hole Size

     0.25mm

     Hole Wall Copper Thickness

     ≥20μm

     Measurement

     300×400mm

     Packaging

     Inner: Vacuum-packed in soft plastic bales 
     Outer: Cardboard Cartons with double straps

     Application

     Communication,automobile,cell,computer,medical 

     Advantage

     Competitive Price,Fast Delivery,OEM&ODM,Free Samples,

     Special Requirements

     Buried And Blind Via, Impedance Control, Via Plug, 
     BGA Soldering And Gold Finger Are Acceptable

     Certification

     UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

     
     

     PRODUCTION CAPABILITY OF PCB

     Process Engineering

     Items

     Manufacturing Capability

     Laminate

     Thickness

     0.2~3.2mm

     Production Type

     Layer Count

     2L-16L

     Cut Lamination

     Max. Working Panel size

     1000×1200mm

     Inner Layer

     Internal Core Thickness

     0.1~2.0mm

     Internal width/spacing

     Min: 4/4mil

     Internal Copper Thickness

     1.0~3.0oz

     Dimension

     Board Thickness Tolerance

     ±10%

     Interlayer Alignment

     ±3mil

     Drilling 

     Manufacture Panel Size

     Max: 650×560mm

     Drilling Diameter

     ≧0.25mm

     Hole Diameter Tolerance

     ±0.05mm

     Hole Position Tolerance

     ±0.076mm

     Min.Annular Ring 

     0.05mm

     PTH+Panel Plating

     Hole Wall copper Thickness

     ≧20um

     Uniformity

     ≧90%

     Outer Layer

     Track Width

     Min: 0.08mm

     Track Spacing

     Min: 0.08mm

     Pattern Plating

     Finished Copper Thickness

     1oz~3oz

     EING/Flash Gold

     Nickel Thickness

     2.5um~5.0um

     Gold Thickness

     0.03~0.05um

     Solder Mask

     Thickness

     15~35um

     Solder Mask Bridge

     3mil

     Legend

     Line width/Line spacing

     6/6mil

     Gold Finger

     Nickel Thickness

     ≧120u〞

     Gold Thickness

     1~50u〞

     Hot Air Level

     Tin Thickness

     100~300u〞

     Routing

     Tolerance of Dimension

     ±0.1mm

     Slot Size

     Min:0.4mm

     Cutter Diameter

     0.8~2.4mm

     Punching

     Outline Tolerance

     ±0.1mm

     Slot Size

     Min:0.5mm

     V-CUT

     V-CUT Dimension

     Min:60mm

     Angle

     15°30°45°

     Remain Thickness Tolerance

     ±0.1mm

     Beveling

     Beveling Dimension

     30~300mm

     Test

     Testing Voltage

     250V

     Max.Dimension

     540×400mm

     Impedance Control

     Tolerance

     ±10%

     Aspect Ration

     12:1

     Laser Drilling Size

     4mil(0.1mm)

     

    Contact Details
    Shenzhen Zhong Yi Xin Circuit Co,. ltd.

    Contact Person: Mr. Bryant

    Tel: 86-0755-23599617-8:00

    Fax: 86-0755-23599617

    Send your inquiry directly to us (0 / 3000)