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1.6 mm FR4 1 oz PCB Board Layout ENIG Immersion Gold UL and RoHs Certificates

1.6 mm FR4 1 oz PCB Board Layout ENIG Immersion Gold UL and RoHs Certificates

1.6 mm FR4 1 oz PCB Board Layout ENIG Immersion Gold UL and RoHs Certificates

Product Details:

Place of Origin: China
Brand Name: ZYX
Certification: UL, CE, RoHs, REACH, SGS
Model Number: ZYX

Payment & Shipping Terms:

Minimum Order Quantity: 10 PCS
Price: Negotiate
Packaging Details: Plastic bag + bubble packaging
Delivery Time: 5-7 DAYS
Payment Terms: L/C,T/T, Paypal, West Union
Supply Ability: 2 Million PCS Per Month
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Detailed Product Description

Detailed Product Description
 

1.6 mm FR4 1 oz PCB Board Layout ENIG Immersion Gold UL and RoHs Certificates

 

 

Quick Details:

1. Professional PCB manufacturer.

2. PCBA,OEM,ODM service are provided.

3. Gerber file needed.

4. Products are 100% E-tested.

5. Quality guarantee and professional after-sale service.

 

 PRODUCT’S DETAILS

 Raw Material

 FR-4 (Tg 180 available)

 Layer Count

 4-Layer

 Board Thickness

 1.6 mm

 Copper Thickness

 1.0 oz

 Surface Finish

 ENIG/ Immersion Gold

 Solder Mask

 Green

 Silkscreen

 White

 Min. Trace Width/Spacing

 0.075/0.075mm

 Min. Hole Size

 0.25mm

 Hole Wall Copper Thickness

 ≥20μm 

 Measurement

 300×400mm

 Packaging

 Inner: Vacuum-packed in soft plastic bales 
 Outer: Cardboard Cartons with double straps

 Application

 Communication,automobile,cell,computer,medical 

 Advantage

 Competitive Price,Fast Delivery,OEM&ODM,Free Samples,

 Special Requirements

 Buried And Blind Via, Impedance Control, Via Plug, 
 BGA Soldering And Gold Finger Are Acceptable

 Certification

 UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

 
 

 PRODUCTION CAPABILITY OF PCB

 Process Engineering

 Items

 Manufacturing Capability

 Laminate

 Thickness

 0.2~3.2mm

 Production Type

 Layer Count

 2L-16L

 Cut Lamination

 Max. Working Panel size

 1000×1200mm

 Inner Layer

 Internal Core Thickness

 0.1~2.0mm

 Internal width/spacing

 Min: 4/4mil

 Internal Copper Thickness

 1.0~3.0oz

 Dimension

 Board Thickness Tolerance

 ±10%

 Interlayer Alignment

 ±3mil

 Drilling

 Manufacture Panel Size

 Max: 650×560mm

 Drilling Diameter

 ≧0.25mm

 Hole Diameter Tolerance

 ±0.05mm

 Hole Position Tolerance

 ±0.076mm

 Min.Annular Ring 

 0.05mm

 PTH+Panel Plating

 Hole Wall copper Thickness

 ≧20um

 Uniformity

 ≧90%

 Outer Layer

 Track Width

 Min: 0.08mm

 Track Spacing

 Min: 0.08mm

 Pattern Plating

 Finished Copper Thickness

 1oz~3oz

 EING/Flash Gold

 Nickel Thickness

 2.5um~5.0um

 Gold Thickness

 0.03~0.05um

 Solder Mask

 Thickness

 15~35um

 Solder Mask Bridge

 3mil

 Legend

 Line width/Line spacing

 6/6mil

 Gold Finger

 Nickel Thickness

 ≧120u〞

 Gold Thickness

 1~50u〞

 Hot Air Level

 Tin Thickness

 100~300u〞

 Routing

 Tolerance of Dimension

 ±0.1mm

 Slot Size

 Min:0.4mm

 Cutter Diameter

 0.8~2.4mm

 Punching

 Outline Tolerance

 ±0.1mm

 Slot Size

 Min:0.5mm

 V-CUT

 V-CUT Dimension

 Min:60mm

 Angle

 15°30°45°

 Remain Thickness Tolerance

 ±0.1mm

 Beveling

 Beveling Dimension

 30~300mm

 Test

 Testing Voltage

 250V

 Max.Dimension

 540×400mm

 Impedance Control

 Tolerance

 ±10%

 Aspect Ration

 12:1

 Laser Drilling Size

 4mil(0.1mm)

 

Contact Details
Shenzhen Zhong Yi Xin Circuit Co,. ltd.

Contact Person: Mr. Bryant

Tel: 86-0755-23599617-8:00

Fax: 86-0755-23599617

Send your inquiry directly to us (0 / 3000)